JPH0416039B2 - - Google Patents

Info

Publication number
JPH0416039B2
JPH0416039B2 JP60003759A JP375985A JPH0416039B2 JP H0416039 B2 JPH0416039 B2 JP H0416039B2 JP 60003759 A JP60003759 A JP 60003759A JP 375985 A JP375985 A JP 375985A JP H0416039 B2 JPH0416039 B2 JP H0416039B2
Authority
JP
Japan
Prior art keywords
weight
crystallized glass
circuit board
multilayer circuit
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60003759A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61163696A (ja
Inventor
Hisaharu Shiromizu
Asao Morikawa
Tsuneyuki Sukegawa
Kazuo Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP375985A priority Critical patent/JPS61163696A/ja
Publication of JPS61163696A publication Critical patent/JPS61163696A/ja
Priority to US07/320,796 priority patent/US4943470A/en
Publication of JPH0416039B2 publication Critical patent/JPH0416039B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Glass Compositions (AREA)
JP375985A 1985-01-11 1985-01-11 多層回路基板 Granted JPS61163696A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP375985A JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板
US07/320,796 US4943470A (en) 1985-01-11 1989-03-09 Ceramic substrate for electrical devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP375985A JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5000109A Division JPH0732312B2 (ja) 1993-01-04 1993-01-04 多層回路基板

Publications (2)

Publication Number Publication Date
JPS61163696A JPS61163696A (ja) 1986-07-24
JPH0416039B2 true JPH0416039B2 (en]) 1992-03-19

Family

ID=11566101

Family Applications (1)

Application Number Title Priority Date Filing Date
JP375985A Granted JPS61163696A (ja) 1985-01-11 1985-01-11 多層回路基板

Country Status (1)

Country Link
JP (1) JPS61163696A (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63147395A (ja) * 1986-12-10 1988-06-20 日本特殊陶業株式会社 高密度配線多層基板の製造法
JPS63265493A (ja) * 1987-04-23 1988-11-01 Fujitsu Ltd 多層セラミツク基板
JP7659709B1 (ja) * 2023-06-07 2025-04-09 日本板硝子株式会社 ガラス組成物、ガラス繊維、及びガラスフィラー

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599992A (ja) * 1982-07-08 1984-01-19 株式会社日立製作所 多層配線基板の製造方法
JPS61111598A (ja) * 1984-10-13 1986-05-29 富士通株式会社 ガラスセラミツクス多層基板の製造方法

Also Published As

Publication number Publication date
JPS61163696A (ja) 1986-07-24

Similar Documents

Publication Publication Date Title
EP0805785B1 (en) Low dielectric loss glasses
JPS61142759A (ja) Ｉｃパツケ−ジ用基板
JP3528037B2 (ja) ガラスセラミック基板の製造方法
US4943470A (en) Ceramic substrate for electrical devices
US5122930A (en) High heat-conductive, thick film multi-layered circuit board
JPH0946013A (ja) スルーホール充填用導体ペースト及びセラミック回路基板
JP4703212B2 (ja) 配線基板及びその製造方法
JPH04212441A (ja) セラミック配線基板
JP2002193691A (ja) 低誘電率セラミック焼結体及びその製造方法、並びにそれを用いた配線基板
JPH0416039B2 (en])
JPS59107596A (ja) セラミツク多層配線回路板
US5955938A (en) RuO2 resistor paste, substrate and overcoat system
JP4422453B2 (ja) 配線基板
KR100744855B1 (ko) 높은 열적 사이클 전도체 시스템
JP3559407B2 (ja) ガラスセラミック焼結体およびそれを用いた多層配線基板
JP2003224338A (ja) ガラスセラミック配線基板
US5352482A (en) Process for making a high heat-conductive, thick film multi-layered circuit board
JPH11186727A (ja) 配線基板およびその製造方法
JP3441941B2 (ja) 配線基板およびその実装構造
JP3441950B2 (ja) 配線基板およびその実装構造
JP4514301B2 (ja) 多層配線基板の製造方法
JP4575614B2 (ja) 複合セラミック基板
JP2004119547A (ja) セラミック配線基板およびその製造方法
JP4658465B2 (ja) コンデンサ内蔵ガラスセラミック多層配線基板
JP2000264719A (ja) 磁器組成物および磁器並びにそれを用いた配線基板